Onto Innovation Debuts Sub-surface Defect Inspection for Advanced Packaging
Tuesday, 23 April 2024 () WILMINGTON, Mass.--(BUSINESS WIRE)---- $ONTO--Onto Innovation Inc. (NYSE: ONTO) today announced the release of a new sub-surface inspection capability for the Dragonfly® G3 sub-micron 2D/3D inspection and metrology platform. The new capability enables whole wafer inspection for critical yield impacting defects that can lead to lost die as well as entire wafers breaking in subsequent process steps. Such defects were previously impossible to find in a production environment. In today’s world of wafer thinn
Tuesday, 23 April 2024 ()
